CFD Analysis of Various Height of Pin Fin Heat Sink in Inline Arrangement

The electronic device became the part in a daily life, hence it is our responsibility to increase the life of such electronic devices by providing efficient cooling to the heat producing systems, else it causes permanent failure of hard disks,cpu, chipset, graphic cards etc. the heat sink is  the major part that produces heat energy continuosly results in decrease the life of such devices very rapidly this produced heat can be removed by adopting various heat dissipation techniques like providing fans for air cooling , liquids for liquid cooling and with the help of heat sink to keep the temperature within the permissible safe range.

In the present paper the work has been carried out on efficient heat sink for cooling of electronic devices. The modification of existing heat sink depends on various geometric parameters like, fin length, fin height, fin thickness, number of fins, base plate thickness, space between fins, fin shape or material etc. and based on the concept of standard pin fin, splayed pin fin and hybrid pin fin heat sinks the new model with various heights of fin, the heat sink is developed which is observed as a pyramid structure and also obtained the result with increasing heat dissipation rate. The analysis is done by using CFD, ansys fluent.